Tssop Package

25 l a1 a l1 seating plane bottom view exposed thermal pad e2 d1 mdp0048. TSSOP-8: Package, Reel, Taping: Alpha & Omega Semicondu TSSOP-8: Tape and Reel Dimensions: Global Mixed-mode Techn TSSOP-8: Package Outline: STMicroelectronics: TSSOP14: 14-LEAD THIN SHRINK SMALL OUTLINE: NXP Semiconductors: TSSOP16: Low-voltage 8-bit I2C-bus and SMBus low power I/O port with interrupt, weak pull-up and Agile I/O: ATMEL Corporation: TSSOP28: Socket and Footprint Card. This text is here inThis text is here in. LM2904ST – General Purpose Amplifier 2 Circuit 8-MiniSO from Rohm Semiconductor. 30mm(tssop) to (. Package Type: TSSOP; Device Type: Buffer Technology: CMOS. Adapters for SOP / SSOP / uSOP packages. 28 , Switching Outputs for the SSOP , TSSOP, TVSOP, and LFBGA Packages 28 Comparison of Electrical and , WidebusTM SMD SSOP , TSSOP, TVSOP, and LFBGA Packages Johannes Huchzermeier Standard Linear and Logic. What's more, you can be running PCB Pro within minutes. My website link for downloads (if any are present), etc: http://youtube. com 5/8 TSZ02201-TSSOP-B8-1-2 ©2016 ROHM Co. Thin small outline package (TSOP) is a type of surface mount IC package. MAX17502H Evaluation Kit Evaluates: MAX17502H in TSSOP Package ˜˜ Component List General Description. Learn More Newest Products Back Newest Products Check out the latest parts added to Digi-Key's massive inventory of electronic components. com 5/8 TSZ02201-TSSOP-C48V-1-2 ©2016 ROHM Co. A Dimensions are in millimeters ©2002 Fairchild Semiconductor Corporation 16 Lead TSSOP Package Dimensions TSSOP-16 6. EX146-5001-1 Package Weight [g] 0. 5 mm pitch, 12. 1 mm body) $8. TSSOP - Logic functions in thin-shrink small outline surface mount packages Nexperia’s TSSOP logic portfolio comprises functions in 14-, 16-, 20-, and 24- pin packages as well as 16-bit functions in 48- 56- and 64-pin packages. Anti-static Tubes provide exceptional ESD protection while maintaining a very low cost of packaging to product ratio. 65mm_ThermalPad. It should be used in conjunction with. IC package SMD TSSOP (thin-shrink small outline package) from 8 to 56 pins version. Materials -- Protoboard and Kapton Tape are essentials. Tzn powiem tak ja zastosowalem otoczenie takie jakie mialo byc przy texasie natomiast zamiast texasa wstawilem Analoga i chodzi to wszystko ok otocze. Some adapters are programmer specific and we recommend checking the software for compatibility prior to ordering. Package Structure. By continuing to browse the site, you are agreeing to our use of cookies. Your analog power IC and the best power management. 7-T-DE-D , VSSOP8 Daisy Chain , VSSOP10 Daisy Chain , MAB08A , U-TSSOP-8 , 8VSSOP , 8-VSSOP. Standard search with a direct link to product, package, and page content when applicable. , SMD SSOP , TSSOP, TVSOP, and LFBGA Packages SCYA007 List of Figures (continued) 26. TSSOP-16 (0. PCB dimensions: 700 mils x 800 mils x 62. 4) March 12, 2012 www. Enter a package ID or package type to search IDT's database. TSSOP stands for Thin Shrink Small Outline Package. TSSOPs (Thin-Shrink Small Outline Packages) and MSOPs (Micro Small Outline Packages) are leadframe-based and plastic encapsulated, suited for applications requiring 1 mm or less mounted height. 7-T-DE-D, VSSOP8E19. By continuing to browse the site, you are agreeing to our use of cookies. Features, Specifications, Alternative Product, Product Training Modules, and Datasheets are all available. It has best-in-class Additive Phase Jitter of 50 fsec RMS. Mold flash, protrusions or gate burrs shall 3. SOP Packages ・ ・ P. half-bridges), known as HTSSOP. Package Type: TSSOP; Device Type: Buffer Technology: CMOS. The 5PB1110 is a high-performance 1:10 LVCMOS clock buffer. The fully packed feature set bridges the gap between complex, high cost, high maintenance software and low-end unsupported products. Output is PLCC 20 pins plugging to PLCC socket and more $9. TSSOP-8 PACKAGE MARKING DESCRIPTION LOGO 3 2 1 3 6 C PART NO. TSSOP20 Datasheet, TSSOP20 PDF, TSSOP20 Data sheet, TSSOP20 manual, TSSOP20 pdf, TSSOP20, datenblatt, Electronics TSSOP20, alldatasheet, free, datasheet, Datasheets. Notice of Disclaimer The information disclosed to you hereunder (the “Materia ls”) is provided solely for the selection and use of Xilinx products. It is available in 20-pin QFN and TSSOP packages and can operate from a 1. BREAKOUT BOARDS / TSSOP - Thin Shrink Small-Outline Package. 2 MHz TSSOP-14, LM324 in the Distrelec Online Shop | We love electronics. IC package SMD TSSOP (thin-shrink small outline package) from 8 to 56 pins version. 4) March 12, 2012 www. aspx This is a video of me making use of a SSOP device with the Arduino. Thin Very Small-Outline Package (TVSOP) Figure 3 shows TI’s SSOP, TSSOP, and TVSOP surface-mount packages with pin pitches of 0. All Acronyms. Tzn powiem tak ja zastosowalem otoczenie takie jakie mialo byc przy texasie natomiast zamiast texasa wstawilem Analoga i chodzi to wszystko ok otocze. 3V in the Distrelec Online Shop | We love electronics. TSSOP8 Datasheet, TSSOP8 PDF, TSSOP8 Data sheet, TSSOP8 manual, TSSOP8 pdf, TSSOP8, datenblatt, Electronics TSSOP8, alldatasheet, free, datasheet, Datasheets, data. STM32F042 TSSOP20 0. Title: Package dimensions MSOP, SSOP, TSSOP-A2. 27mm), and TSSOP is typically smaller and metric, as well as thinner. BREAKOUT BOARDS / TSSOP - Thin Shrink Small-Outline Package. You can solder a header into the 0. 6 mils) pitch Mfr. It has best-in-class Additive Phase Jitter of 50 fsec RMS. indd Created Date: 8/4/2006 1:07:11 PM. For more information. 8mm grid pitch. TSSOP (VO20/VOG20) Package PK068 (v1. I'm trying to design a board around the TSSOP version of the TLC5940 IC (a 16-channel LED driver) present in SparkFun's Eagle library. A DIP can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0. 4mm) 05-08-1650 Author: Linear Technology Corporation Keywords: Packaging Created Date: 7/25/2005 8:41:16 AM. The clock output is compliant to PCIe Gen 1 specifications. 3) package width does not include interlead flash or protrusion. Image Abbrv Full Name JEDEC/JEITA SOIC-N-EP SOIC narrow body with exposed pads with heatsink batwing SOIC, SOIC-BAT: SOIC thermally enhanced with fused leads (batwings). Visually, it looks like you could take a SOIC and push down from the middle to flatten the pins out and you would have a TSSOP. These IC packages are particularly suited for gate drivers, controllers, wireless / RF, op amps, logic, analog, ASICs, memory (EPROM, E²PROM), comparators and optoelectronics. Options include small outline packages such as wafer level chipscale (CSP), Ultra-Dual Flat No Lead (UDFN), Ultra-Quad Flat No Lead (UQFN), plastic Shrink Small Outline (SSOP), plastic Think Shrink Small Outline (TSSOP), plastic Small Outline (SOIC), Thin Quad Flat Pack (TQFP), Ball Grid Array (BGA), and Plastic Dual In-Line (PDIP). New assembly site for SOIC and TSSOP packages Dear Customer: You are receiving this announcement because you have purchased one or more of the products listed on the attachment. I created a custom library following an online tutorial for the DAC and copied the TSSOP 38 package for a different existing library. 7-T-DE-D , VSSOP8 Daisy Chain , VSSOP10 Daisy Chain , MAB08A , U-TSSOP-8 , 8VSSOP , 8-VSSOP. Jump to Package & Packing Information ·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for. Thin Very Small-Outline Package (TVSOP) Figure 3 shows TI's SSOP, TSSOP, and TVSOP surface-mount packages with pin pitches of 0. You can solder a header into the 0. Shopping for Cheap TSSOP Package at Yida Electronics Co. TSSOP,TSSOP Package,TS SOP Packags. 65 mm the width of the pads varies from. 27mm), and TSSOP is typically smaller and metric, as well as thinner. Controlling dimension is mm. Price (USD) $7. 65 mm pin pitch) to DIP-16 (300 mil body width, 0. The "SOIC" type chips are somewhat larger, with a 1. 25 L L1 ID MARK PIN 1 θ2 θ3 c Y1 Y2 Y X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS. Package Size Comparison – 6 Leads Scale: 12:1 TSOP6 (SOT457) (SM6) (SMT6) (Mini6) (SOT23-6) (SC-74) (SC-59-6) SC-88 (SOT363) (US6) (UMT6) (S-Mini6) (SC-70-6). The payback. ラピスセミコンダクタ半導体商品のSOP、SSOP、TSOP(TypeⅠ)、TSOP(TypeⅡ)パッケージ外形寸法データを提供するページです。. 9 Packing Style 5 unit boxes or less per shipping box (unit:mm) Shipping Box Dimension X 372 Y 368 Z 305 3. TSSOP-8 Breakout Board (3 x 3 mm, 0. 9 Packing Style 5 unit boxes or less per shipping box (unit:mm) Shipping Box Dimension X 372 Y 368 Z 355 3. 7T-DE-D, VSSOP8T19. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0. Package Type: TSSOP; Device Type: Buffer Technology: CMOS. Pin pitch is typically 0. TSSOP stands for Thin Shrink Small Outline Package. Package Type : TSSOP-20 Test Item Test Condition Number Tested Number Tested Time Failed High Temperature Storage 150 ℃ 78 (d) 1000h 0 高温保存試験 Temperature Cycling –65 ℃~150 78 (d) 200cyc 0 温度サイクル Pressure Cooker Test 121℃,100%RH:2. and more from tssop16,mp8126,tssop-16,ic,tssop,original on Aliexpress. TSSOP 28 Pin (Thin Shrink Small Outline): Modeled using Texas Instruments' package dimensions KiCad footprint w/ model hosted on [https. Ic Pcb Converter Plate Board Sop So Tssop Msop Sot Qfp Tqfp Lqfp To Dip Adapter. Package Tolerance Number Footprint Dimension (mm) of Pin. , SMD SSOP , TSSOP, TVSOP, and LFBGA Packages SCYA007 List of Figures (continued) 26. The enamel wire was pulled out of an electric motor, my callipers tell me it's 0. TSOP - Thin Small Outline Package The Thin Small Outline Package, or TSOP, is a rectangular IC package with a thickness of 1. Philips Semiconductors PC board footprint This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. Features, Specifications, Alternative Product, Product Training Modules, and Datasheets are all available. Hi, I do not have a Hot air/Reflow station and I do not make PCBs at all but an IC that I want to use only comes in a 6 pin TDFN package. Package Information Package Name TSSOP-B30 Type SOP Pin Count 30 Outline Dimension Drowing No. Title: Package Drawing - TSSOP 14-Lead Plastic (4. and more from CW1055 TSSOP-30,tssop16,mp8126,original,assurance,ic on Aliexpress. TSSOP-8 (FS PKG Code S4) TSSOP-8 Package Dimensions January 2000, Rev. TSSOP8 Datasheet, TSSOP8 PDF, TSSOP8 Data sheet, TSSOP8 manual, TSSOP8 pdf, TSSOP8, datenblatt, Electronics TSSOP8, alldatasheet, free, datasheet, Datasheets, data. Package Information : SOP16 1. This quality adapter can mount a 24-pin SOIC-24 IC on one side or a TSSOP-24 IC on the other side and convert it to DIP-24 footprint. June 2002, Rev. 4mm) 05-08-1650 Author: Linear Technology Corporation Keywords: Packaging Created Date: 7/25/2005 8:41:16 AM. Table 1 lists TSSOP and SSOP packages available for STM8 and STM32 microcontrollers, as well as the corresponding shipping media. Package Type : TSSOP-20 Test Item Test Condition Number Tested Number Tested Time Failed High Temperature Storage 150 ℃ 78 (d) 1000h 0 高温保存試験 Temperature Cycling -65 ℃~150 78 (d) 200cyc 0 温度サイクル Pressure Cooker Test 121℃,100%RH:2. TSSOP abbreviation stands for Thin Shrink Small Outline Package. Programming adapters, IC footprint chip changing adapters, and ZIF socket to PCB pads adapters. The trick is to mount those small components on a “breakout PCB” first, after which they can readily be handled, used, and re-used on a breadboard. TSSOP-8 Breakout Board (3 x 3 mm, 0. Title: Footprint for TSSOP,TSSOP-8 Subject: POD for TSSOP,TSSOP-8 Keywords: POD,TSSOP,TSSOP-8. Registration or login required. This notice describes a change to the package assembly of multiple DEI products. 3) package width does not include interlead flash or protrusion. com ,the Leading Trading Marketplace from China. Package Information. The ultra-small footprint (3x3 mm) and industry leading low power consumption make Si52111-A1/A2 the ideal clock solution for consumer and embedded. Package Structure. Mouser offers inventory, pricing, & datasheets for TSSOP-20 ARM Microcontrollers - MCU. The 5PB1110 is a high-performance 1:10 LVCMOS clock buffer. Adafruit Industries, Unique & fun DIY electronics and kits SMT Breakout PCB for SOIC-8, MSOP-8 or TSSOP-8 - 6 Pack! ID: 1212 - Beguiled by a fancy new chip that is only available in a SOIC or MSOP/(T)SSOP pinout?. By continuing to browse the site, you are agreeing to our use of cookies. We are offering MAX20053AUD/V+CMS for competitive price in the global market, please send us a quota request for pricing. Dimension "D" and "EI" does not include mold protrusion. The antistatic/conductive tape provides a secure cavity for the product when sealed with the “peel−back. Im Vergleich zum TSSOP-Package ist das. 00: FedEx 2nd Day: $15. Estimate for United States: Regular Post (4-10 days) $4. List of TSSOP Thyristors Product Specs, Datasheets, Manufacturers & Suppliers. Materials are RoHS compliant. I have found that a lot of IC`s are not being made in DIP packages anymore. The leads are brought in closer and the body has been shrunk as well. 9 Packing Style 5 unit boxes or less per shipping box (unit:mm) Shipping Box Dimension X 372 Y 368 Z 305 3. Odds are a TSSOP part will fit a SSOP footprint. 5 V, 16-Pin TSSOP MAX3226ECUE+ or other Line Transceivers online from RS for next day delivery on your order plus great service and a great price from the largest electronics components. The lead pitch is often finer than that commonly used in the standard SOG package. Package Tolerance Number Footprint Dimension (mm) of Pin. New assembly site for SOIC and TSSOP packages Dear Customer: You are receiving this announcement because you have purchased one or more of the products listed on the attachment. step573K HTSSOP-20-1EP. Our comprehensive portfolio of IC package technical data provides information on package types, package outlines, IC package land patterns, lead-free and. For minimum order quantity, please contact Sales Department. package outline drawing for 14-tssop mf-po-d-0025 revision 1. What is the best way to use this IC? Shall I attempt to solder wires onto the. It distributes one input clock signal (CLKIN) to the output clocks (1Y[0:3]). DESCRIPTION AOTE32136C 32136C CODE Green product AOTE32136C Marking Description Version Document No. SOIC-14 (FS PKG Code S2) SOIC-14 Package Dimensions. FutureWafer Tech Co. 3,Sanmin Rd. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0. Zirconia Aluminosilicate Refractory Ceramic Fibres are fibres covered by index number 650-017-00-8 in Annex VI, part 3, table 3. overall its likely that either way they will fit the footprint. The one that appears to fit is: Housings_SSOP:TSSOP-8_3x3mm_Pitch0. CD4022BPWR TSSOP PW 16 2000 367. Thin-Shrink Small Outline Package Quarter-Size Small Outline Package ( QSOP ) Die ICs auf DRAM - Speichermodulen waren üblicherweise TSOPs, bis diese Bauform durch das sogenannte Ball Grid Array (BGA) abgelöst wurde. Tssop-20 Original Package 8-bit Microcontrollers Voltage Regulator Logic Ics Driver Ic Stm32f042f6p6 Stm32f042f6 Stm32f042 , Find Complete Details about Tssop-20 Original Package 8-bit Microcontrollers Voltage Regulator Logic Ics Driver Ic Stm32f042f6p6 Stm32f042f6 Stm32f042,Stm32f042 Mcu 32-bit Stm32 Arm M0 Risc 32kb Flash 2. A number of these packages are also Dual In-line Packages [DIP]. Package Outline Dimensions PG-TSSOP-8-1. Add the suffix -T1 for tape and reel with standard options Part numbers ending in "E" such as "AM4502CE" feature ESD protection * Some devices may be rated at a slightly different V GS , please consult data sheet. Si52111-A1/A2 is a high-performance, PCIe clock generator that can source one PCIe clock output from a 25 MHz crystal or clock input. SMD Package,BGA Package,SO Package,SOT Package,SOIC Package,TQFP Package,PLCC Package,SOP Package,PGA Package,SSOP Package,TSSOP Package,SMT Package. Adapters for TO packages. July 1999, Rev. Get contact details, address, map on IndiaMART. Package Information. 2) package length does not include mold flash, protrusion or gate burr. Registration or login required. 7T-DE-D, VSSOP10T19. ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead pitch. A development board for the STM32F042 TSSOP package Posted on Oct 31, 2015 in hardware , stm32 It's been a while since I posted a new article, a delay at least partly due to me herniating a disc in my neck which left me completely unable to look downwards for any length of time and as you'll know all too well you can't work on circuit. 10 Label Specification www. These industry standard packages run in very high volume and provide a value added, low cost solution for a wide range of applications. PLCC Plug Base: EPL-0020 PLCC-20 Plug Used with your prototype design. It seems the long width of the TSSOP package was designed for tight layout situations described below. 9mm thick) than standard SOIC packages. A Can package is a cylindrical shaped package with leads attached to one end. PCB operating temperature range: -40C to +130C. 29 : In Stock : TSSOP-38 to DIP-38 SMT Adapter (0. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0. This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. The clock output is compliant to PCIe Gen 1 specifications. 5 mm pitch) $6. No one of them was working, even if I tried to lower the soldering temperature. The footprints for the pull-up (RxU) and pull-down (RxD) devices are labeled in relation to the TSSOP package, pin 1 is connected to R1U and R1D (which is connected to pin 20 of the SSOP device on the bottom of the board). Thin small outline package (TSOP) is a type of surface mount IC package. 1-A low dropout linear regulator (LDO) includes current monitoring with externally settable current limit and temperature monitoring with external control of thermal limit temperature. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0. 10 Label Specification www. With hundreds of programmable and standard configurations available in several QFN and TSSOP package options, the lead-free solutions operate at -40C to +85C and are targeted for use in switches/routers, high-end storage and server platforms for enterprise and data center usage, SONET/SDH transport and access equipment, xPON equipment, video servers and cellular base stations. 65mm ht…. Read about how we use cookies and how you can control them by clicking "Cookie Settings. So TSSOP package aligns center in only one of the shunt pads. 5 mm pitch, 12. Next-day delivery! Buy Non Volatile Digital Potentiometer 1kOhm Linear I²C TSSOP in the Distrelec Online Shop | We love electronics. Das Gehäuse mit 56 Pins hat eine Breite von 6,1 mm und eine Länge von 14,0 mm, die Dicke beträgt 0,9 mm. Small Outline Package with Exposed Pad. 1 b 12°(4x) E1 0. Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0. Title: Footprint for TSSOP,TSSOP-8 Subject: POD for TSSOP,TSSOP-8 Keywords: POD,TSSOP,TSSOP-8. TSSOP packages provide 35 to 65 % space saving compared to SOIC solutions. 4(mm), 16pin, 3000(/Reel) TSSOP-16 | Your analog power IC and the best power management, TOREX. TSSOP-16 Minimum Packing Quantity. 001-04165 Rev. Pin Configuration. Visually, it looks like you could take a SOIC and push down from the middle to flatten the pins out and you would have a TSSOP. natural impurity. Disclaimer. TSSOP-8 (FS PKG Code S4) TSSOP-8 Package Dimensions January 2000, Rev. liuzengqiang. It is not only resistant to high temperature, but also has high precision to operate together with the equipment. Adapters for SOP / SSOP / uSOP packages. A DIP can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case. Search for acronym meaning, ways to abbreviate, and lists of acronyms and abbreviations. Package Size Comparison - 6 Leads Scale: 12:1 TSOP6 (SOT457) (SM6) (SMT6) (Mini6) (SOT23-6) (SC-74) (SC-59-6) SC-88 (SOT363) (US6) (UMT6) (S-Mini6) (SC-70-6). 094" thick PCB. RANGE PACKAGE (Green) G1559D21U G1559FA1U G1559 G1559-401C~ +851C -401C~ +851C TSSOP-14 TSSOP-14 (FD) Note: D2: TSSOP-14 1: Bonding Code U: Tape & Reel FA: TSSOP-14 (FD) Pin Configuration G1559 G1559 , 8 VOUTC TSSOP-14 TSSOP-14 (FD) Note: Recommend connecting the Thermal Pad to the Pin. Sensata Technologies (Formerly Wells-CTI) Status - SOLD OUT More due 10/14/19. not exceed 0. 9 Packing Style 5 unit boxes or less per shipping box (unit:mm) Shipping Box Dimension X 372 Y 368 Z 355 3. Again, I'm lazy, so lets do what we can to 'reuse' an existing package. A Dimensions are in millimeters ©2002 Fairchild Semiconductor Corporation 16 Lead TSSOP Package Dimensions TSSOP-16 6. 14 Pin Open top, TSSOP type package test socket. The details of this change are on the following pages. EX146-5001-1 Package Weight [g] 0. IC Package 6. The 5PB1110 is a high-performance 1:10 LVCMOS clock buffer. Check the data sheets for the real numbers, but pin pitch varies from. Vishay - manufacturer of discrete semiconductors and passive components. 2 MHz TSSOP-14, LM324 in the Distrelec Online Shop | We love electronics. Order today, ships today. TSSOP-8 package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components. DesignSpark PCB Pro - Now available. Aprilog makes & stocks IC adapters for QFP, TQFP, QFN, MLF, SOIC, SSOP, TSSOP, TSOP, VSOP, SOP, PLCC, PGA & SOT packages and stocks test sockets by Enplas, Plastronics, Sensata, Yamaichi & Tokyo Electech. Pricing and Availability on millions of electronic components from Digi-Key Electronics. 9 Packing Style 5 unit boxes or less per shipping box (unit:mm) Shipping Box Dimension X 372 Y 368 Z 305 3. These industry standard IC packages offer a substantial increase in heat dissipation, yield a. 2) package length does not include mold flash, protrusion or gate burr. Pin Configuration. Learn More Newest Products Back Newest Products Check out the latest parts added to Digi-Key's massive inventory of electronic components. You need to be cautious the other way around. 25 L L1 ID MARK PIN 1 θ2 θ3 c Y1 Y2 Y X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS. LLP (Leadless Leadframe Package) 比較的小規模なICに用いられる超小型・薄型のパッケージ。MSOP、TSSOP、TQFPなどより小さいCSP用パッケージとしてナショナル セミコンダクターにより近年開発されたもので、LLPという名称は同社の登録商標である。プラスチック製の板. The TSSOP has a tighter lead pitch is thinner (at 0. Part Number:25-08 Lighting Components & Design Inc Electronic Components ICs, Stock Category:Available stock, 25-08 PCB Footprint and Symbol, 25-08 Datasheet, Description:Midget Grooved Grounded Or Non-Grounding Lampholde. Below you'll find a complete list of related information. 3) package width does not include interlead flash or protrusion. 7T-DE-D, VSSOP8E-T-D , VSSOP8E7A19. ePad Thin-Shrink Small Outline Package, Micro Small Outline Package, Small Outline Integrated Circuit and Shrink Small Outline Packages (TSSOP, MSOP. Media in category "TSSOP integrated circuit packages" The following 41 files are in this category, out of 41 total. Note 2: Report available from Cypress Sales Offices or Distributors. These industry standard packages run in very high volume and provide a value added, low cost solution for a wide range of applications. Ic Pcb Converter Plate Board Sop So Tssop Msop Sot Qfp Tqfp Lqfp To Dip Adapter. 35 EPL-0032 PLCC-32 Plug Used with your prototype design. and more from tssop16,mp8126,tssop-16,ic,tssop,original on Aliexpress. All dimensions are in millimeters. On this adapter you can solder a TSSOP-14 package IC to get standard DIP pins with 0. Next-day delivery! Buy Operational Amplifier 3. 14 Pin Open top, TSSOP type package test socket. Acer Extensa 5220 - display driver PCB - MPS MP1010BEF-4793. 4 Changed the term ejector pin to ejector pin mark. The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes, smaller lead pitches and package thickness (0. Filter packages by entering lead count or product description into the search box below: Package Outline. The fully packed feature set bridges the gap between complex, high cost, high maintenance software and low-end unsupported products. These IC packages are particularly suited for gate drivers, controllers, wireless / RF, op amps, logic, analog, ASICs, memory (EPROM, E²PROM), comparators and optoelectronics. SOIC-14 (FS PKG Code S2) SOIC-14 Package Dimensions. TSSOP-8 package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components. »Privacy Policy Accept»Privacy Policy Accept. 3) package width does not include interlead flash or protrusion. Note 4: Actual testing performed on package family basis. The CDCV304 operates at 3. 00: FedEx Overnight (Cutoff 3PM EST) $28. 6MHz TSSOP-20 in the Distrelec Online Shop | We love electronics. 3v 20-pin Tssop Stm32f042f6p6,Tssop-20mcu Chip 48mhz/32kb Flash. Pricing and Availability on millions of electronic components from Digi-Key Electronics. 01_00 | Jul 11, 2017 | PDF | 258 kb. Notice of Disclaimer The information disclosed to you hereunder (the "Materia ls") is provided solely for the selection and use of Xilinx products. 15mm (203 mils) Body length 0. Table 1 lists TSSOP and SSOP packages available for STM8 and STM32 microcontrollers, as well as the corresponding shipping media. 4mm (252 mils) Leads Tip to tip 5. com ,the Leading Trading Marketplace from China. Features, Specifications, Alternative Product, Product Training Modules, and Datasheets are all available. TSSOP-14 Breakout Board (4. Enplas IC Test & Burn-in Socket, for SSOP20, TSSOP20 package. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0. In order to optimize your browsing experience Infineon uses cookies. 5 mm pitch) $6. The 54 Ball Grid Array Package is organized as a 6 x 9 array with balls on a. Adapters for SOP / SSOP / uSOP packages. 03/12/12 1. View TSSOP Package IC, details & specifications from Nextech, a leading Wholesale Trader of Integrated Circuits in Off Lamington Road, Mumbai, Maharashtra. Select a package family below, or search all TI packages to explore TI's complete package portfolio. 7T-DE-D, VSSOP10T19. The MAX17502H evaluation kit (EV kit) provides a prov-en design to evaluate the MAX17502H high-efficiency, high-voltage, synchronous step-down DC-DC converter in a TSSOP package. Original: PDF. 05mm, anodized The surface of the box is smooth and burr-free, which fully meets the technical requirements of mainstream. Monitoring low side PWM where one half TSSOP package pins 5-8 may sometimes lie directly under the shunt ground feeds top side of 0. Programming adapters, IC footprint chip changing adapters, and ZIF socket to PCB pads adapters. This information can be used by customers to determine compliance to the various environmental legislation that exists worldwide. With hundreds of programmable and standard configurations available in several QFN and TSSOP package options, the lead-free solutions operate at -40C to +85C and are targeted for use in switches/routers, high-end storage and server platforms for enterprise and data center usage, SONET/SDH transport and access equipment, xPON equipment, video servers and cellular base stations. 7-T-DE-D , VSSOP8 Daisy Chain , VSSOP10 Daisy Chain , MAB08A , U-TSSOP-8 , 8VSSOP , 8-VSSOP. Materials are RoHS compliant. 10 millimeters max. The DAC I need to use is a TSSOP 38 package (AD5348). com Package Dimensions (F) TSSOP Package 8-Pin SYMBOL DESIG A B C D E F G H J K L M N O P Q R R1 MIN 4. As well, this particular TSSOP also has a wider package than a typical TSSOP. TSSOP-C48V Package Information 3. Der Abstand der Pins beträgt 1/4", entsprechend 0,65 mm. 7-T-DE-D, VSSOP8E19. Package Information Package Name TSSOP-B30 Type SOP Pin Count 30 Outline Dimension Drowing No. Output is PLCC 20 pins plugging to PLCC socket and more $9. Quantity Tape Width Part Number Suffix Bulk-Loose 96 — — 13" Reel 2,500 12mm -13. The 5PB1110 is a high-performance 1:10 LVCMOS clock buffer. 9 mm) than the standard SOP. 65 mm pin pitch) to DIP-16 (300 mil body width, 0. TSSOP (VO20/VOG20) Package PK068 (v1. 7T-DE-D, VSSOP8T19. Small and efficient packages. The footprints for the pull-up (RxU) and pull-down (RxD) devices are labeled in relation to the TSSOP package, pin 1 is connected to R1U and R1D (which is connected to pin 20 of the SSOP device on the bottom of the board). An IP package [In-line package] is a rectangular package having one row (or two or more parallel rows) of terminals oriented perpendicular to the package seating plane. IC Package Types The semiconductor industry manufactures a very huge variety of integrated circuits that have different packaging requirements. You need to be cautious the other way around. In order to optimize your browsing experience Infineon uses cookies. They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. describe what the ejector. 65 mm the width of the pads varies from. ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead pitch. wrl218K HTSSOP-20-1EP_4. Add the suffix -T1 for tape and reel with standard options Part numbers ending in "E" such as "AM4502CE" feature ESD protection * Some devices may be rated at a slightly different V GS , please consult data sheet. Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. They are surface mount packages with gull-wing pins. Handles such packages as MSOP, SOIC, PLCC, SSOP and TSSOP.